www.clare.com ds-cpc3701-r02 1 cpc3701 60v, depletion-mode, n-channel vertical dmos fet rohs 2002/95/ec e 3 pb part # description cpc3701c n-channel depletion mode fet, sot-89 pkg. cut-tape, available in quantities of 200, 300, 400, 500, and 600 CPC3701CTR n-channel depletion mode fet, sot-89 pkg. tape and reel (1000/reel) v (br)dsx / v (br)dgx r ds(on) (max) i dss (min) package 60v 1 ? 600ma sot-89 applications features description ordering information circuit symbol ? ignition modules ? normally-on switches ? solid state relays ? converters ? security ? power supplies ? depletion mode device offers low r ds(on) at cold temperatures ? low on-resistance: 1 ? max. at 25oc ? high input impedance ? low v gs(off) voltage: -0.8 to -2.9v ? small package size sot-89 the cpc3701 is an n-channel, depletion mode, field effect transistor (fet) that utilizes clare?s proprietary third-generation vertical dmos process. the third-generation process realizes world class, high voltage mosfet performance in an economical silicon gate process. our vertical dmos process yields a robust device, with high input impedance, for use in high-power applications. the cpc3701 is a highly reliable fet device that has been used extensively in clare?s solid state relays for industrial and security applications. the cpc3701 has a minimum breakdown voltage of 60v, and is available in the sot-89 package. as with all mos devices, the fet structure prevents thermal runaway and thermal-induced secondary breakdown. package pinout (sot-89) s g d g d s d
www.clare.com 2 r02 cpc3701 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc electrical characteristics @ 25oc (unless otherwise noted) parameter ratings units drain-to-source voltage 60 v p gate-to-source voltage 15 v p pulsed drain current 1 a total package dissipation 1 1.1 w operational temperature -55 to +125 o c storage temperature -55 to +125 o c 1 mounted on 1"x1" fr4 board. parameter symbol conditions min typ max units drain-to-source breakdown voltage v (br)dsx v gs = -5v, i d =100a 60 - - v gate-to-source off voltage v gs(off) v ds = 5v, i d =1 ? a -0.8 - -2.9 v change in v gs(off) with temperature dv gs(off) /dt v ds = 5v, i d =1 ? a - - 4.5 mv/ o c gate body leakage current i gss v gs =15v, v ds =0v - - 100 na drain-to-source leakage current i d(off) v gs = -5v, v ds =60v - - 1 a v gs = -5v, v ds =40v, t a =125oc - - 1 ma saturated drain-to-source current i dss v gs = 0v, v ds =15v 600 - - ma static drain-to-source on-state resistance r ds(on) v gs = 0v, i d =300ma --1 ? change in r ds(on) with temperature dr ds(on) /dt - - 1.1 %/ o c turn-on delay time t d(on) v ds = 25v i d = 300ma v gs = 0v to -10v r gen = 50 ? - -70 ns rise time t r -40 turn-off delay time t d(off) -50 fall time t f - 150 source-drain diode voltage drop v sd v gs = -5v, i sd =300ma - 0.6 1.8 v thermal resistance (junction to ambient) r ? ja - - 90 - oc/w switching waveform & test circuit 90% 10% 90% 90% 10% 10% pulse generator v dd r l output d.u.t. t on t d(on) t off t d(off) input input output 0v v ds r gen 0v -10v t f t r
cpc3701 www.clare.com 3 r02 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating cpc3701c msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time cpc3701c 260oc for 30 seconds board wash clare recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. chlorine-based or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. rohs 2002/95/ec e 3 pb
clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products incl uding, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or make changes to its products at any time without notice. specification: ds-cpc3701-r02 ?copyright 2012, clare, inc. all rights reserved. printed in usa. 3/9/2012 for additional information please visit our website at: www.clare.com 4 cpc3701 mechanical dimensions cpc3701c cpc3701c tape & reel dimensions mm min / mm max (inches min / inches max) 2.286 / 2.591 (0.090 / 0.102) 3.937 / 4.242 (0.155 / 0.167) 1.397 / 1.600 (0.055 / 0.063) 0.356 / 0.432 (0.014 / 0.017) 1.626 / 1.829 (0.064 / 0.072) r 0.254 (r 0.010) 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 4.394 / 4.597 (0.173 / 0.181) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) 0.60 (0.024) typ 3 1.40 (0.055) 2.45 (0.096) 1.90 (0.075) 1.90 (0.074) 45o 5.00 (0.197) 50o pcb land pattern pin 1 dimensions mm (inches) embossment embossed carrier 177.8 dia (7.00 dia) top cover tape thickness 0.102 max (0.004 max) w=12.00 0.3 (0.472 0.012) b 0 =4.60 0.1 (0.181 0.004) a 0 =4.80 0.1 (0.189 0.004) p=8.00 0.1 (0.315 0.004) k 0 =1.80 0.1 (0.071 0.004) 2.00 0.05 (0.079 0.002) 4.00 0.1 (0.157 0.004) 1.75 0.1 (0.069 0.004) 5.50 0.05 (0.217 0.002)
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